Rectifier diode Chip
Rectifier Diode Chip
Iyo rectifier diode chip yakagadzirwa neRUNAU Electronics yakatanga kuunzwa neGE processing standard uye tekinoroji inowirirana neUSA application standard uye inokodzera nevatengi vepasirese.Inoratidzwa muhutano hwakasimba hwekupisa kuneta, hupenyu hurefu hwebasa, high voltage, yakakura ikozvino, simba rekugadzirisa kwezvakatipoteredza, etc. Chip imwe neimwe inoedzwa paTJM, kuongorora kusina kujeka hakubvumirwi zvachose.Iko kusawirirana kusarudzwa kwemachipisi maparamita anowanikwa kuti apihwe zvinoenderana nezvinodiwa zvekushandisa.
Parameter:
| Diameter mm | Ukobvu mm | Voltage V | Cathode Out Dia. mm | Tjm ℃ |
| 17 | 1.5±0.1 | ≤2600 | 12.5 | 150 |
| 23.3 | 1.95±0.1 | ≤2600 | 18.5 | 150 |
| 23.3 | 2.15±0.1 | 4200-5500 | 16.5 | 150 |
| 24 | 1.5±0.1 | ≤2600 | 18.5 | 150 |
| 25.4 | 1.4-1.7 | ≤3500 | 19.5 | 150 |
| 29.72 | 1.95±0.1 | ≤2600 | 25 | 150 |
| 29.72 | 1.9-2.3 | 2800-5500 | 23 | 150 |
| 32 | 1.9±0.1 | ≤2200 | 27.5 | 150 |
| 32 | 2±0.1 | 2400-2600 | 26.3 | 150 |
| 35 | 1.8-2.1 | ≤3500 | 29 | 150 |
| 35 | 2.2±0.1 | 3600-5000 | 27.5 | 150 |
| 36 | 2.1±0.1 | ≤2200 | 31 | 150 |
| 38.1 | 1.9±0.1 | ≤2200 | 34 | 150 |
| 40 | 1.9-2.2 | ≤3500 | 33.5 | 150 |
| 40 | 2.2-2.5 | 3600-6500 | 31.5 | 150 |
| 45 | 2.3±0.1 | ≤3000 | 39.5 | 150 |
| 45 | 2.5±0.1 | 3600-4500 | 37.5 | 150 |
| 50.8 | 2.4-2.7 | ≤4000 | 43.5 | 150 |
| 50.8 | 2.8±0.1 | 4200-5000 | 41.5 | 150 |
| 55 | 2.4-2.8 | ≤4500 | 47.7 | 150 |
| 55 | 2.8-3.1 | 5200-6500 | 44.5 | 150 |
| 63.5 | 2.6-3.0 | ≤4500 | 56.5 | 150 |
| 63.5 | 3.0-3.3 | 5200-6500 | 54.5 | 150 |
| 70 | 2.9-3.1 | ≤3200 | 63.5 | 150 |
| 70 | 3.2±0.1 | 3400-4500 | 62 | 150 |
| 76 | 3.4-3.8 | ≤4500 | 68.1 | 150 |
| 89 | 3.9-4.3 | ≤4500 | 80 | 150 |
| 99 | 4.4-4.8 | ≤4500 | 89.7 | 150 |
Technical specification:
RUNAU Electronics inopa simba semiconductor chips ye rectifier diode uye welding diode.
1. Kudonha kwemagetsi kuderera
2. Iyo metallization yegoridhe ichashandiswa kuvandudza conductive uye kupisa kupisa pfuma.
3. Double layer protection mesa
Mazano:
1. Kuti irambe ichiita zvirinani, chip ichachengetwa munitrogen kana vacuum mamiriro ekudzivirira kushanduka kwemagetsi kunokonzerwa neoxidation uye humidity ye molybdenum zvidimbu.
2. Nguva dzose chengetedza chip pamusoro yakachena, ndapota pfeka magirovhosi uye usabata chip nemaoko asina maoko.
3. Shanda zvakanyatsonaka mukugadzirisa kushandiswa.Usakuvadza resin mupendero wepamusoro we chip uye aluminium layer munzvimbo yepole yegedhi uye cathode.
4. Mukuyedzwa kana encapsulation, ndapota cherechedza kuti parallelism, flatness uye clamp simba chigadziriso chinofanira kuenderana neyakatsanangurwa zviyero.Kusaenderana kwakashata kunozokonzera kusaenzana kudzvanywa uye kukuvara kwechip nechisimba.Kana yakawandisa clamp simba ikaiswa, iyo chip ichakuvadzwa nyore.Kana yakatemerwa clamp simba iri diki zvakanyanya, iyo isina kunaka kubata uye kupisa kupisa kuchakanganisa application.
5. Chivharo chekumanikidza chinosangana nekathodhi pamusoro pechiputi chinofanira kuvharwa
Recommend Clamp Force
| Chips Size | Clamp Force Recommendation |
| （KN）±10% | |
| Φ25.4 | 4 |
| Φ30 kana Φ30.48 | 10 |
| Φ35 | 13 |
| Φ38 kana Φ40 | 15 |
| Φ50.8 | 24 |
| Φ55 | 26 |
| Φ60 | 28 |
| Φ63.5 | 30 |
| Φ70 | 32 |
| Φ76 | 35 |
| Φ85 | 45 |
| Φ99 | 65 |